This is a complete Wi-Fi MCU module which is designed for embedded wireless solution and a cost-effective, low power capabilities high performance MCU in M2M applications. It includes standards-based wired and wireless technologies to enable IP infrastructures for smart grid, smart home, security, building automation, toys, robots, remote health and wellness monitoring and other M2M applications.

The module integrates ARM CortexTM-M3 MCU, clock, Wi-Fi and front end into a smallest form factor LGA package. It is based on Broadcom IEEE802.11 b/g/n antenna diversity single-stream Broadcom align technology. Thus, it can be used to enable wireless connectivity to the simplest existing sensor products with minimal engineering effort.

The solution is provided as a module to reduce development time, lower manufacturing costs, save board space, ease certification, and minimize RF expertise required. Additionally it is provided as a complete platform solution including software drivers, sample applications, API guide, user documentation and a world-class support community.


GBS 535 Sip Module

MCU STM32 ARM 32-bit Cortex™-M3 Frequency up to 120 MHz
Memory capacity 1 Mbytes of Flash
128 + 4 Kbytes of SRAM
512 bytes of OTP memory
Diverse serial interface SPI, USART
Sensor application support ADC, 12C, 12S, GPIO, CAN bus, 8-bit parallel camera interface
Timer, USB
Debug interface support JTAG
On-chip functionality single-chip MAC/BB/RF
Frequency Band 2.4 GHz
Network Standard 802.11b, 802.11g, 802.11n (single stream)
Modulation modes CCK and OFDM with BPSK, QPSK, 16 QAM, 64 QAM
Hardware Encryption WEP, WPA/WPA2
Support Date Rates IEEE 802.11b 1 -11 Mbps
IEEE 802.11g 6 -54 Mbps
IEEE 802.11n (2.4 GHz) 7.2 – 72.2 Mbps
Advanced 1x1 802.11n features Full/Half Guard Interval
Frame Aggregation
Space Time Block coding (STBC)
Low Density Parity Check (LDPC) Encoding
Two antenna configurations Support antenna diversity
Operating Temperature -40°C to 85°C
MSL level 3  
Certification FCC and CE compliant

Block Diagram: